Year: 2025
Type: article
Abstract: characterization demonstrate that the Cu-Ag bonding can facilitate the *CO spillover from Ag to Cu sites, while the electronic modification of Cu by Ag accelerates the subsequent formation of acetate on Cu sites.
Source: Chemical Science
DOI: 10.1039/d4sc07772e
Authors: Zemin Feng, Chenghong Hu, Huangcong Tang, Kui Shen, Liyu Chen, Yingwei Li
Language: English
Field: Energy
Domain: Physical Sciences
Open Access status: diamond
Funders: National Natural Science Foundation of China, Natural Science Foundation of Guangdong Province, State Key Laboratory of Pulp and Paper Engineering, Guangdong Provincial Pearl River Talents Program, Guangzhou Municipal Science and Technology Project, Fundamental Research Funds for the Central Universities
OpenAlex ID: W4409625955
