An integrated miniaturized self-biased circulator based on the low-temperature D2W bonding technique
Year: 2025
Type: article
Abstract: A high-quality, high-yield integration of oriented M-type thick ferrite film with a SiC substrate through a simple and robust low-temperature thermocompression bonding technique is reported, solving the issue that ferrite devices, particularly ferrite circulators, cannot be integrated with planar RF circuits. Based on this bonding technique, a miniaturized self-biased circulator is successfully integrated onto a SiC substrate. This circulator, measuring 3.0 mm × 2.8 mm and operating at 35 GHz, exhibits a relatively low insertion loss of 1.2 dB, a bandwidth of 2.5 GHz, and a maximum isolation of 17 dB.
Source: IEICE Electronics Express
Authors: Haoran Wang, Tao Zhang, Chongmei Peng, Zhaohui Chen
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W4409632816
