Work

Design and Fabrication of FS-IGBTs With Enhanced Ruggedness and the Influence of Circuit Parameters on Short-Circuit

Year: 2025

Type: article

Source: IEEE Transactions on Device and Materials Reliability

DOI: 10.1109/tdmr.2025.3562558

Authors: Jingping Zhang, Houcai Luo, Huan Wu, Bofeng Zheng, Guoqi Zhang, Xianping Chen

Institutions: Chongqing University, Delft University of Technology

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

Awards: 基于高通量的Janus型二维气敏材料设计与性能调控研究, G6489716644

OpenAlex ID: W4409640619

FWCI: 0.225

Cites: 28

Cited by: 1

Related to: 10