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A Novel Substrate-Embedded SiC Power Module With Integrated Liquid Cooling

Year: 2025

Type: article

Source: IEEE Transactions on Power Electronics

DOI: 10.1109/tpel.2025.3563077

Authors: Xinnan Sun, Min Chen, Jie Li, Fengze Hou, Yifei Du, Yucheng Wu, Bodong Li

Institutions: Zhejiang University, Chinese Academy of Sciences, Institute of Microelectronics

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4409640819

FWCI: 1.577

Cites: 30

Cited by: 7

Related to: 10