Work

Research on Machine Learning-Assisted Numerical Simulation Methods for IGBT Module Bonded Interface Fatigue Damage

Year: 2025

Type: article

Source: IEEE Journal of Emerging and Selected Topics in Power Electronics

DOI: 10.1109/jestpe.2025.3562891

Authors: Shengjun Zhao, Tong An, Fei Qin

Institution: Beijing University of Technology

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G2033729135

OpenAlex ID: W4409640926

FWCI: 0.924

Cites: 48

Cited by: 4

Related to: 10