Work

Evolutions in technology enabling the AI era

Year: 2025

Type: conference-paper

DOI: 10.1117/12.3056887

Author: Eric A. Karl

Institution: Intel (United States)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

OpenAlex ID: W4409655098

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Related to: 10