Application of digital scanner for die to wafer bonding with sub-micron bonding pad pitch
Year: 2025
Type: conference-paper
DOI: 10.1117/12.3050599
Authors: Yoji Watanabe, Yuho Kanaya, Ikumi Inoh, Atsushi Kamashita, Hajime Mitsuishi, Toshiaki Sakamoto, Kazuo Masaki, Soichi Owa, Thomas Koo, Bryant Lin, Michael Tan, David Tseng, Conrad Sorensen, Stephen P. Renwick, Bausan Yuan
Institutions: Nikon (Japan), Nikon (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4409655271