Work

Plasma atomic layer etching of molybdenum with surface fluorination for next-generation interconnect

Year: 2025

Type: conference-abstract

DOI: 10.1117/12.3050967

Authors: Heeju Ha, Yongjae Kim, Minsung Jeon, Heeyeop Chae

Institution: Sungkyunkwan University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4409655678

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