Work

3D Superconducting interconnections

Year: 2025

Type: conference-abstract

DOI: 10.1117/12.3056415

Authors: Jean-Philippe Michel, Jean Charbonnier, Candice Thomas, Edouard Deschaseaux, Pablo Renaud, Céline Feautrier, Rémi Franiatte, Olivier Mailliart, Frédéric Berger, Meriem Guergour, Charles Bon-Mardion, Baptiste Jadot, Corentin Beilvert, Norman Vivien, Christophe Dubarry

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4409655723

Cites:

Cited by: 1

Related to: 10