Work

Optimization of the Wire Bonding Process for Enhanced Thermomechanical Performance of Quad Flat No-Lead (QFN) Packages in Automotive Applications

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3563367

Authors: Mei-Ling Wu, Che-Wei Kang

Institution: National Sun Yat-sen University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4409659338

FWCI: 0.231

Cites: 35

Cited by: 1

Related to: 10