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Study on the Action Mechanism of a Nontraditional Thioamide-Based Leveler of 1-Phenyl 2-Thiourea for Microvia Void-Free Filling

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Year: 2025
Type: article
Source: ACS Applied Materials & Interfaces
DOI: 10.1021/acsami.5c04034
Authors: Zhao-Yun Wang, Li-Xin Yu, Yu-Qing Feng, Lei Jin, Jia-Qiang Yang, Yi Zhao, Tao Song, DongPing Zhan, Daquan Yu, Fang-Zu Yang, Shi-Gang Sun
Institutions: Xiamen University, Yangtze Normal University
Language: English

Topic: Electrodeposition and Electroless Coatings
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China
Awards: G2865147417, G4008174109, 高端电子制造中盲孔/通孔铜连线的电化学沉积过程及添加剂分子作用机理研究, G7067876613
OpenAlex ID: W4409673043
FWCI: 1.386
Cites: 53
Cited by: 6
Related to: 10
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