Work

Dry etch challenges for patterning middle-of-line (MOL) dual damascene contact trench and via in monolithic CFET (complementary FET)

Year: 2025

Type: conference-paper

DOI: 10.1117/12.3052052

Authors: Tanushree Sarkar, Anne Vandooren, Karen Stiers, Cassie Sheng, Victor Vega Gonzalez, Hailey Jenkins, Marc Demand, Peng Wang, Frédéric Lazzarino, Steven Demuynck, Naoto Horiguchi, Serge Biesemans

Institutions: IMEC, Tokyo Electron (Japan)

Language: English

Topic: Advancements in Photolithography Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4409677261

FWCI:

Cites: 7

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Related to: 10