Logic patterning and roughness improvement applications with directional ion beam etch
Year: 2025
Type: conference-paper
DOI: 10.1117/12.3051506
Institutions: Lam Research (United States), IMEC, ASML (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4409679238
