Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles
Year: 2025
Type: article
Authors: Hongbo Qin, Quanzheng Tan, Jian Huang, Bi Wang, Shaohao Zhu, Miao Cai, Yao Zhu, Xiaohui Zhao, Can Yin, Kailin Pan, Wangyun Li
Institution: Guilin University of Electronic Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4409692443