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Advancement of epoxy resins with enhanced wettability and thermal properties for flip-chip packaging

Year: 2025
Type: article
Abstract: Epoxy resins play a critical role in flip-chip packaging due to their superior mechanical strength , chemical resistance, and electrical insulation properties . However, their intrinsic limitations in thermal conductivity and wettability pose significant challenges for high-performance electronic applications, where efficient heat dissipation and reliable interfacial bonding are essential. To address these challenges, the integration of natural and synthetic fillers into epoxy resins has emerged as a promising approach to enhance both thermal and wettability properties, ensuring better performance in flip-chip assemblies. This review explores recent advancements in using natural fillers such as calcium carbonate , lignin, and bio-based nanomaterials , along with synthetic fillers like silica , alumina , and carbon-based materials, to improve the thermal management and wetting behavior of epoxy resins in flip-chip packaging. The review delves into the effects of filler type, dispersion methods, and surface modification techniques on thermal performance and wettability improvements in epoxy systems . Challenges such as filler compatibility and processing scalability are addressed, alongside environmental considerations related to the use of natural versus synthetic fillers. This review provides a comprehensive evaluation of the role of advanced fillers in improving epoxy resin performance, highlighting their relevance for enhancing thermal management and interfacial bonding in flip-chip packaging, while identifying future research opportunities for optimized filler-epoxy composites in electronic applications.
DOI: 10.1016/j.mssp.2025.109535
Language: English
Open Access status: hybrid
Estimated APC paid: $3,540
OpenAlex ID: W4409710896
FWCI: 2.04
Cites: 172
Cited by: 9
Related to: 10