Work

Improvement of bonding interface in electroless copper-plated joints using a high copper concentration copper–quadrol complex solution

Year: 2025

Type: article

Source: Materials Science in Semiconductor Processing

DOI: 10.1016/j.mssp.2025.109601

Authors: J.H. Huang, P.S. Shih, S.J. Gräfner, V. Renganathan, Y.E. Chen, M.H. Hsieh, C.L. Kao, C.L. Kao, Y.S. Lin, Y.C. Hung, A.M. Moreno, T. Jiang, C.R. Kao, C.R. Kao

Institutions: National Taiwan University, Advanced Semiconductor Engineering (Taiwan), University of Central Florida

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Science and Technology Council, National Science and Technology Council

Awards: G1347669455, G2806394711

OpenAlex ID: W4409710900

FWCI: 0.678

Cites: 19

Cited by: 3

Related to: 10