Work

Innovative Packaging Strategy for MLCCs for High Current AC Applications Aimed at Reducing Parasitic Inductance

Year: 2025

Type: conference-paper

Source: IEEE International Workshop on Integrated Power Packaging (IWIPP)

DOI: 10.1109/iwipp61784.2025.10971514

Authors: Sourish S. Sinha, Pouria Zaghari, Jong E. Ryu, Douglas C. Hopkins

Institutions: Ford Motor Company (United States), North Carolina State University

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4409724193

FWCI: 2.277

Cites: 29

Cited by: 1

Related to: 10