Work

Design, Fabrication, and Operation Challenges of Advanced Power Packaging Technology for EV Power Modules

Year: 2025

Type: conference-paper

Source: IEEE International Workshop on Integrated Power Packaging (IWIPP)

DOI: 10.1109/iwipp61784.2025.10971570

Authors: Sourish S. Sinha, Pouria Zaghari, Tzu-Hsuan Cheng, Jong E. Ryu, Douglas C. Hopkins

Institutions: Ford Motor Company (United States), North Carolina State University

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4409724234

FWCI: 4.554

Cites: 26

Cited by: 2

Related to: 10