Work

High-Density Integrated GaN Hybrid Power Module Design with Double-Sided Cooling

Year: 2025

Type: conference-paper

Source: IEEE International Workshop on Integrated Power Packaging (IWIPP)

DOI: 10.1109/iwipp61784.2025.10971510

Authors: Xingyue Tian, Niu Jia, Han Cui, Leon M. Tolbert, Hua Bai

Institution: University of Tennessee at Knoxville

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4409724599

FWCI:

Cites: 16

Cited by:

Related to: 10