Work

GaN based High Power Density PCB Design for Aerial Vehicles Motor Drive Applications

Year: 2025

Type: conference-paper

Source: IEEE International Workshop on Integrated Power Packaging (IWIPP)

DOI: 10.1109/iwipp61784.2025.10971516

Authors: Shahid Aziz Khan, Feng Zhou, DucDung Le, Mengqi Wang, Shivam Chaturvedi

Institutions: University of Michigan, Toyota Motor North America Research & Development (United States)

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4409724776

FWCI: 2.293

Cites: 11

Cited by: 1

Related to: 10