Work

Electrical Characterization of Solderless Interconnections Dedicated to Pressure Assembly Power Modules

Year: 2025

Type: conference-paper

Abstract: This paper presents the electrical characterization of solderless interconnection for the development of modular power modules with pressure assembly thanks to soft materials like metallic foams. This type of material can be used to connect two Printed Circuit Boards (PCB), and allows disassembling and changing the PCB if necessary. Electrical resistances of these soft materials are measured as a function of pressure and compared to classical interconnections like copper plates. With differences higher than 70% compared to copper plates, soft materials seem interesting for low resistance packaging interconnections.

Source: IEEE International Workshop on Integrated Power Packaging (IWIPP)

DOI: 10.1109/iwipp61784.2025.10971546

Authors: Paul Bruyere, Eric Vagnon, Yvan Avenas