Work

Solder Void Impact on Power Device Thermal Impedance using Transient Thermal Analysis

Year: 2025

Type: conference-paper

Source: IEEE International Workshop on Integrated Power Packaging (IWIPP)

DOI: 10.1109/iwipp61784.2025.10971713

Authors: Nathan Carlson, Nick Baker

Institution: University of Alabama

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4409724941

FWCI: 6.901

Cites: 9

Cited by: 3

Related to: 10