Work

Advanced packaging raw materials assurance by characterization

Year: 2025

Type: conference-paper

DOI: 10.1117/12.3050826

Authors: Liton Kumar Biswas, Patrick J. Craig, Nitin Varshney, Antika Roy, Clark Duke Godinez, Pauline Paki, Navid Asadizanjani

Institutions: University of Florida, United States Department of Homeland Security, Southern Methodist University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4409759279

FWCI:

Cites: 16

Cited by:

Related to: 10