Work

Accurate Analytical Modeling of 3-D Capacitor Based on Coaxial TSV Array and RDL

Year: 2025

Type: article

Source: IEEE Transactions on Electron Devices

DOI: 10.1109/ted.2025.3560589

Authors: Xinqing Lei, Xiangkun Yin, Ziyu Zhou, Gang Dong, Zhangming Zhu

Institution: Xidian University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Awards: G1981401797, G2320218852, G8921095769

OpenAlex ID: W4409762843

FWCI: 0.68

Cites: 27

Cited by: 3

Related to: 10