Halogen-Free Epoxy with Enhanced Corrosion Resistance for Microelectronics Packaging via γ S N 2 Nucleophilic Substitution
Year: 2025
Type: article
Source: Chemistry of Materials
Institutions: Zhejiang University, Hangzhou Normal University
Language: English
Topic: Epoxy Resin Curing Processes
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G7675989882
OpenAlex ID: W4409765631