Single-step deep reactive ion etch of silicon for through-via applications with alternative gas mixtures
Year: 2025
Type: article
DOI: 10.1116/6.0004465
Authors: Richa Agrawal, Nathan Marchack, Devi Koty, Hien Nguyen, Qingyun Yang, Rosa Goss, Steve Molis, Marinus Hopstaken, Bang To, Roger Goss, Jose Daboin, Jeffrey C. Shearer, Robert L. Bruce
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4409769451