Work

Bonding Mechanism of Cold Gas-Sprayed Copper Particles Onto Aluminum Nitride Substrates for Power Electronics Packaging

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3564520

Authors: Margie Guerrero-Fernandez, Ozan Ozdemir, Zhu Ning, Paul Allison, Brian Jordon, Pedro Quintero

Institutions: University of Puerto Rico-Mayaguez, Northeastern University, Baylor University

Language: English

Topic: High-Temperature Coating Behaviors

Subfield: Aerospace Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Alfred P. Sloan Foundation, Army Research Laboratory

Award: G5887100244

OpenAlex ID: W4409796079

FWCI:

Cites: 41

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Related to: 10