Work

Impact of CF4 plasma etching on defect formation and material properties of Al2O3 thin films

Year: 2025

Type: article

Abstract: Fluorine-based plasma etching of Al2O3 induces changes in oxygen vacancy concentrations and aluminum bond modifications, which affect the electrical properties of the thin film, leading to increased leakage currents and the formation of charge traps that degrade the device reliability. Therefore, in this study, we systematically examined the effects of CF4 plasma etching on the structural, optical, and electrical properties of Al2O3 thin films, focusing on defect dynamics during processing. X-ray photoelectron spectroscopy analysis demonstrated that Al-O to Al-F bond conversion occurred during plasma etching, resulting in modified oxygen vacancy concentrations. Chemical modifications induced changes in the optical bandgap and work function with increasing radiofrequency bias power, indicating a change in the electronic band structure. Dielectric measurements indicated reduction in dielectric constant due to Al-F bond formation. These results elucidate the relationship between plasma-induced defects, including both defect generation and atomic substitution by plasma, contributing to the development of high-quality Al2O3 thin films for electronic applications in the future.

Source: Physica Scripta

DOI: 10.1088/1402-4896/add21e