Work

Investigation of the Adhesion Mechanism of Electro-Less Copper Plating on Surface Reformed Resin by Using a 172 nm Xe2* Excimer Lamp

Year: 2024

Type: article

Abstract: Copilot を始めとした対話型の生成 AI

Source: Journal of The Surface Finishing Society of Japan

DOI: 10.4139/sfj.75.494

Author: Taro ARIMOTO

Institutions: Ushio (Japan), The University of Osaka

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: diamond

OpenAlex ID: W4409979816

FWCI:

Cites: 9

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Related to: 10