Work

Board Level Reliability of Gull-wing, Micro-leaded and Lead-less Packaged MOSFETs in Automotive Environments

Year: 2025

Type: conference-paper

Source: IEEE Applied Power Electronics Conference and Exposition (APEC)

DOI: 10.1109/apec48143.2025.10977096

Authors: Christopher Liu, Vijayakrishna Satyamsetti, Xuanjing Wei, Christian Radici, Peter Vines, Wayne Lawson

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4409991508

FWCI:

Cites: 5

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Related to: 10