Work

Experimental Validation of Triangular SOA via Infrared Thermography of a MOSFET Die Operating in the Thermally Unstable Linear-mode for Automotive Applications

Year: 2025

Type: conference-paper

Source: IEEE Applied Power Electronics Conference and Exposition (APEC)

DOI: 10.1109/apec48143.2025.10977146

Authors: Yacine Ayachi Amor, Christian Radici, Kerry J. Abrams, Philip Ellis, Peter Vines, Wayne Lawson

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4409991815

FWCI: 2.358

Cites: 5

Cited by: 1

Related to: 10