Work

Thermal Modeling and Performance of a Bare-Die Embedded PCB for High Power Density Converters Design

Year: 2025

Type: conference-paper

Source: IEEE Applied Power Electronics Conference and Exposition (APEC)

DOI: 10.1109/apec48143.2025.10977134

Authors: Shahid Aziz Khan, Feng Zhou, Mengqi Wang, DucDung Le, Shivam Chaturvedi

Institutions: University of Michigan, Toyota Motor North America Research & Development (United States)

Language: English

Topic: Advanced DC-DC Converters

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4409992161

FWCI: 4.601

Cites: 7

Cited by: 2

Related to: 10