Work

Impact of Structural Variation in SiC MOSFETs on TSEP Performances for Temperature Estimation

Year: 2025

Type: article

Source: IEEE Transactions on Electron Devices

DOI: 10.1109/ted.2025.3564235

Authors: Kun Tan, Meng Luo, Junsong Jiang, Xi Tang, Shu Yang, Cungang Hu, Wenping Cao

Institutions: Anhui University, University of Science and Technology of China

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Science Foundation, National Natural Science Foundation of China, Natural Science Foundation of Anhui Province

Awards: G2251908496, G3433892970, G6766304146, G6935576132

OpenAlex ID: W4410027569

FWCI: 1.352

Cites: 32

Cited by: 6

Related to: 10