Digital lithography technology for advanced packaging manufacturing
Year: 2025
Type: conference-paper
DOI: 10.1117/12.3049294
Authors: Anindarupa Chunder, Cindy Mora, Heather Bailey, Bruce Lee, Clay Yeh, C.C. Chuang, Qin Zhong, Niranjan Khasgiwale, Jang Fung Chen
Institution: Applied Materials (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4410083072