Work

Integration Challenges on 300-mm High Resistivity Silicon Substrates

Year: 2025

Type: article

Source: IEEE Transactions on Semiconductor Manufacturing

DOI: 10.1109/tsm.2025.3567206

Authors: A. Abbadie, A. Desse, K. Melhem, S. Dario Mariani, D. Fagiani, P. Zuliani, F. Faller

Institutions: STMicroelectronics (France), STMicroelectronics (Italy)

Language: English

Topic: Semiconductor materials and devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410086504

FWCI: 0.693

Cites: 24

Cited by: 3

Related to: 10