Machine Learning Based Dynamic TTI Bundling for LTE VoIP Uplink Coverage Improvement
Year: 2025
Type: conference-paper
Authors: Mayank Aggarwal, Shyamal Dhua, Ram Aditya S, Vimal Bastin Edwin Joseph, Bharath Kumar Kalavala, B Jeevan Prakash
Institution: Samsung (India)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4410086813