A Method for Generating and Validating Kiss‐Bond Defects Using Adhesive Films and Sand
Year: 2025
Type: article
DOI: 10.1002/app.57264
Language: English
Subfield: Mechanics of Materials
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G1753741468, G2151222346
OpenAlex ID: W4410093392
