Strong and tough phthalonitrile PCB substrates with semi‐interpenetrating polymer network toughened by highly heat‐resistant poly(aryl ether nitrile)
Year: 2025
Type: article
Source: Polymer Composites
DOI: 10.1002/pc.29958
Language: English
Topic: Epoxy Resin Curing Processes
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4410104348
