Work

Additive Integration of a Bare Die High-Power Microwave Amplifier Using 3-D Printed Interconnects

Year: 2025

Type: article

Source: IEEE Transactions on Microwave Theory and Techniques

DOI: 10.1109/tmtt.2025.3563113

Authors: Christopher Areias, Andrew Luce, Elicia Harper, Yiwen Zhang, Alkim Akyurtlu

Institutions: University of Massachusetts Lowell, RTX (United States)

Language: English

Topic: Nanomaterials and Printing Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: Analog Devices, Raytheon Technologies, Air Force Research Laboratory

Award: G497264525

OpenAlex ID: W4410115172

FWCI: 0.453

Cites: 30

Cited by: 2

Related to: 10