Work

Evaluating the Adhesive Properties of Electroless Cu on Glass-Reinforced Epoxy-Based Build-Up Dielectric Films via Nanoindentation

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3567314

Authors: Yeojin Kang, Wonjung Park, Dayoung Yoo, Kyung-Ah Won, Seung-Gun Lee, Jong-Man Kim, Yangdo Kim, Dongyun Lee

Institutions: Pusan National University, Korea Institute of Science and Technology, LG (South Korea), Korea Institute of Materials Science

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Research Foundation of Korea

Award: G8902797601

OpenAlex ID: W4410115213

FWCI: 0.228

Cites: 34

Cited by: 1

Related to: 10