Work

Die Attach Failure Modes Analysis and Process Optimization for Mass Production Yield Improvement of MicroSD Card COB Packaging

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3567363

Authors: Weiyi Zhang, Guangjun Lu, Rushen Wei, Jingke Huang

Institution: Guangxi Normal University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Guangxi Innovation-Driven Development Project

Award: G5485624044

OpenAlex ID: W4410115217

FWCI: 0.227

Cites: 19

Cited by: 1

Related to: 10