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Ultrahigh Thermally Conductive Graphene-Based Thermal Interface Material with Low Compressive Modulus

Year: 2025

Type: article

Source: ACS Applied Engineering Materials

DOI: 10.1021/acsaenm.5c00198

Authors: Anbang Zhang, Haolong Zheng, Peng He, Shujing Yang, Xiaoming Xie, Guqiao Ding

Institutions: Chinese Academy of Sciences, ShanghaiTech University, Shanghai Institute of Microsystem and Information Technology, University of Chinese Academy of Sciences

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Science and Technology Commission of Shanghai Municipality

Awards: G2601258689, 碳基二维半导体材料C3N的可控制备、物性与器件研究, G993239356

OpenAlex ID: W4410219015

FWCI: 1.908

Cites: 57

Cited by: 9

Related to: 10