Work

Investigation of Crosstalk Noise in a Tri-Interconnect Model Using Pristine and Copper Interconnects With Different Technologies and Wire Spacings

Year: 2025

Type: conference-paper

Source: IEEE International Conference on Interdisciplinary Approaches in Technology and Management for Social Innovation (IATMSI)

DOI: 10.1109/iatmsi64286.2025.10984467

Authors: Aditi Thakur, Sandip Bhattacharya, Subhajit Das

Institutions: SR University, University of Engineering & Management

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410228754

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Cites: 9

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Related to: 10