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Simulation analysis and quality modeling research on the adhesive process of wrapping paper joints

Year: 2025

Type: conference-paper

Source: International Conference on Electronic Information Engineering and Data Processing (EIEDP)

DOI: 10.1117/12.3066953

Authors: Yufei Li, Nanyan Shen, Jing Li

Institution: Shanghai University

Language: English

Topic: Material Properties and Processing

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410235995

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Cites: 11

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Related to: 10