Application of amino acids as auxiliary reagents in chemical mechanical polishing: an in-depth review
Year: 2025
Type: article
Abstract: Chemical mechanical polishing (CMP) is critical in semiconductor and integrated circuit (IC) manufacturing, with increasing demands for higher performance, including minimizing defects, enhancing planarization uniformity, and improving material removal rate (MRR). Amino acids, a key component in CMP slurries, play a significant role due to their zwitterionic nature, biocompatibility, and lower toxicity compared to traditional additives. This review examines the mechanisms through which amino acids interact with various materials such as copper, cobalt, and interlayer dielectrics, impacting MRR, surface quality, and defect rates. The review compares different amino acids under various CMP conditions, focusing on mechanisms like complexation, passivation, and optimization of material selectivity. Additionally, it discusses the sustainability of amino acid-based slurries and provides future research directions for their use in more efficient and eco-friendly semiconductor manufacturing. Graphical Abstract
Source: Surface Science and Technology
Authors: Jiakai Zhou, Chao He, Changxin Dong, Xinjie Li, Zheng Wu, Bin Hu, Jiahui Li, Ziliang Liu, Qing Ma, Shaobo Song, Mengqi Wang, Xinhuan Niu
Institution: Hebei University of Technology
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
Estimated APC paid:
OpenAlex ID: W4410246091