Work

Design and Analysis of Twin Tower High Bandwidth Memory (HBM) Architecture for Large Memory Capacity and High Bandwidth System

Year: 2024

Type: conference-paper

Source: IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

DOI: 10.1109/edaps64431.2024.10988462

Authors: Taesoo Kim, Jiwon Yoon, Seonguk Choi, Haeyeon Kim, Haeseok Suh, Hyunjun An, Jungmin Ahn, Hyunah Park, Joungho Kim

Institution: Korea Advanced Institute of Science and Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410295124

FWCI: 7.812

Cites: 4

Cited by: 10

Related to: 10