Work

Signal Integrity Analysis of Ultra-scaled Copper-Graphene Heterogeneous Interconnect Structure

Year: 2024

Type: conference-paper

Source: IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

DOI: 10.1109/edaps64431.2024.10988469

Authors: Suyash Kushwaha, Devarshi Das, Sourajeet Roy, Rohit Sharma

Institutions: Indian Institute of Technology Ropar, Indian Institute of Technology Roorkee

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410295169

FWCI: 1.778

Cites: 9

Cited by: 1

Related to: 10