Work

Robust Design Optimization applied to unit warpage analysis of exposed die flip-chip package

Year: 2024

Type: conference-paper

Source: IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

DOI: 10.1109/edaps64431.2024.10988488

Authors: Chih-Yen Su, Nai-Jen Hsuan, Ying-Hsi Lin

Institution: Realtek (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410295170

FWCI: 0.806

Cites: 5

Cited by: 1

Related to: 10