Work

Transient Analysis of Through Package Coaxial Vias in Glass Interposers Based on SBTD Method

Year: 2024

Type: conference-paper

Source: IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

DOI: 10.1109/edaps64431.2024.10988489

Authors: K. Madhu Kiran, Suyash Sachdeva, Rohit Dhiman

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410295307

FWCI: 0.806

Cites: 7

Cited by: 1

Related to: 10