Work

Parametric study of factors effecting PMIC-QFN reliability under temperature cycling in DIMM systems

Year: 2024

Type: conference-paper

Source: IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

DOI: 10.1109/edaps64431.2024.10988479

Authors: Nagavenkata Varaprasad Nune, Christopher Glancey, Yeow Chon Ong, Hong Wan Ng, Gokul Kumar

Institutions: Micron (United States), Micron (Singapore)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410295338

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